IEC 61249-8-8:1997 Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
- Abbreviation
- IEC 61249-8-8:1997
- Valid from
- 24/06/1997
- Information provider
- International Electrotechnical Commission,
- Author
- International Electrotechnical Commission
- Information type
- IEC Standard,
- Format
- PDF, HARD COPY,
Description
This part of IEC 61249 provides requirements for the qualification of temporary solder resist coatings. Requirements stated in this specification will also have some limited validity for assessing the suitability of printed boards which are supplied with peelable solder masks.
This resource is cited by:
IEC 61249-8-8:1997 Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
This document is CITED BY:
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BS EN 115-1:2008
IEC 61249-8-8:1997 is cited by BS EN 115-1:2008 Safety of escalators and moving walks Part 1: Construction and installation