IEC 61249-3-5:1999 Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films

Abbreviation
IEC 61249-3-5:1999
Valid from
10/02/1999

Information provider
International Electrotechnical Commission,
Author
International Electrotechnical Commission
Information type
IEC Standard,
Format
PDF, HARD COPY,


Description

This part of IEC 61249 gives requirements for transfer adhesive films for use in the fabrication of flexible multilayer boards or flex-rigid printed boards.

For assistance with locating previous versions, please contact the information provider.
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For assistance with locating previous versions, please contact the information provider.
This resource is cited by:

IEC 61249-3-5:1999 Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films

This document is CITED BY:

IEC 61249-3-5:1999 Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films

Description

This part of IEC 61249 gives requirements for transfer adhesive films for use in the fabrication of flexible multilayer boards or flex-rigid printed boards.

View on Information Provider website
This resource does not cite any other resources.

IEC 61249-3-5:1999 Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films

This resource does not CITE any other resources.
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